CAD-Model for a small housing

This project was successfully completed by rotek for $399 USD in 10 days.

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Project Budget
$100 - $400 USD
Completed In
10 days
Total Bids
Project Description

We have developed a 60x33 mm circuit board, total height will be about 7-11 mm + wall thickness. Your job is to design a CAD model for a suitable housing, which we will have SLS laser sintered in PA plastic for a prototype and which might be used for injection-molding in the future.

You will receive a google sketchup version of the layout of the circuit board, along with a good first sketch for the entire housing. You may want to use particularly the layout of the circuit board, but you will need to import the data to your CAD program.

To give you an idea, the simple housing shape (top shell) might look approximately like shown on the picture attached (outside view, inside view available including ridges etc.). You will need to redesign this in CAD and further improve the model to be feasible and look good in laser sintering as well as injection molding.

There will be 3 holes for electronic components in the housing. Additionally, there will be one LED on the circuit board that needs to be visible from outside. It is maybe sufficient to have a reduced wall thickness of [url removed, login to view] for the LED to become visible, but this is something where you should be competent and advise.

You will also design the mechanism to close and open the housing (close upper and lower shell) Additionally, you will need to design ridges, pins etc. to hold the circuit board, reflect the LED light, etc.

Furthermore, the housing will need to be attached to clothing by an appropriate magnet clip, as found with name tags. You will design the appropriate holder for the magnet clip. We have preselected potential magnets, but you should assist us by consulting on the way to integrate the magnets into the housing or eventually propose a better solution.

You will need intimate knowledge about plastics technology, e.g. the feasibility of certain clip mechanisms, required wall thickness, stability considerations, manufacturability without e.g. sinking, consulting on material etc.

You will receive the circuit board layout including all measurements and positions of all relevant electronic components in a google sketchup version, and a list of the main components and dimensions. You will also receive a google sketchup suggestion for the housing including our ideas and suggestions for the position of ridges, magnetic clips, etc., which you may use or not for further improvements and implementation in CAD. We have clear ideas about the outside design, e.g. rounded edges, and the need to make the housing as small as possible, it should be easy to assemble the circuit board and battery, it must be possible to close and open the upper and the lower shell in the prototype version, etc.

You will need to provide visualizations to us in a format that we can preview with freeware (e.g. pdf), so that we are able to give you feedback for improvement of the visible design. Communication should be by skype voice or google hangout to avoid telephone cost.

You will deliver the original complete CAD data from your software application as well as the STL data which we will forward to our laser sinter service for the prototype or for the injection molding company. You will advise on the selection of a good offer from the manufacturer of the housing, potentially you may additionally recommend a good supplier.

Please state a fixed price and minimum required time after you receive our data, for just the prototype CAD model including STL data for the production. You may charge extra all the time spent on voice communication with us. Please state an hourly rate for this extra communication time.

Later changes to produce the injection molding version are not in scope this time.

Please explain which software product you intend to use. Please indicate appropriate references or prove your detailed knowledge about plastics technology by detailed suggestions/considerations about the issues mentioned above.

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